最高搭載 14+2+1 Duet Rail 供電系統及 80A 智能供電模組設計,能充分釋放處理器的極致性能。
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MSI B850 and B840 motherboards, paired with AMD Ryzen 9000 series processors, set a new standard in the next era of computing by unleashing the power of AI and delivering exceptional gaming experiences. With advanced connectivity, ultra power solution, extreme cooling modules, and EZ DIY-friendly designs, these motherboards are ready to break through limitations and lead the next-level AI PC revolution.
結合SMT 焊接工藝和 MSI 的記憶體強化技術,B850主機板在 DDR 性能上實現了顯著飛躍!
最高搭載 14+2+1 Duet Rail 供電系統及 80A 智能供電模組設計,能充分釋放處理器的極致性能。
實現更快速且無失真的電流傳輸,確保在嚴苛條件下仍能保持高效和可靠的性能表現。
面對多核心處理高負載,也能更安全且穩定地將電力傳輸至處理器,提供最佳效能。
優質電路配置和專為超頻所設計的時脈生成器,為 CPU 超頻創造了理想的條件。
高達 8 層的優化 PCB 設計確保了更高的頻寬和更快的傳輸速度,提供更可靠的電路傳輸,以實現卓越的性能。
全新的 Click BIOS X 提供多項專屬的 CPU 和記憶體超頻功能,使用者可以精確地調整性能,輕輕鬆鬆即可將系統推向極限。
散熱片加大設計提供極大化散熱面積和散熱效率。
避免 M.2 SSD 降速,保護資料安全。
VRM 散熱片覆蓋了上部的 MOS,並有助於散熱。
高品質 7W/mK MOSFET 散熱墊,確保所有核心以高性能運行。
加大的散熱片有效減少灰塵與噪音,並能保持高效的散熱性能。
多功能風扇接頭是一個彈性設計,可同時擔任幫浦或風扇接頭。可自動偵測是否連接了幫浦或 PWM/DC 風扇,獨特的灰色設計更便於識別,輕鬆完成安裝。
可在MSI Center 和 BIOS 進行散熱管理,專為高階遊戲與高速運算所設計,即使在高負載任務下也能確保更穩定的性能表現。
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MSI X870E和X870主機板,搭配AMD Ryzen 9000系列處理器,在下一代計算中樹立了新的標準,釋放了AI的強大力量,並提供了出色的遊戲體驗。 這些主機板擁有先進的連線性、超高效能解決方案、極致散熱模組和易於DIY的設計,已經準備好突破限制,引領下一級AI PC革命。
Combining a dedicated SMT welding process and MSI's Memory Boost technology, the X870(E) motherboards achieve a significant leap in DDR performance, with the MEG X870E GODLIKE even surpassing 9000 MT/s!
With up to 24+2+1 Duet Rail Power System and 110A Smart Power Stage design, the X870(E) motherboards are ready to push CPU performance to its limits.
Enables faster and distortion-free current delivery, ensuring efficient and reliable performance under demanding conditions.
Delivers stable and sufficient power, even for overclocked multi-core CPUs, ensuring peak performance under heavy loads.
Premium layout and dedicated clock generator create the perfect condition for CPU overclocking.
Up to 10-layer optimized PCB design ensures higher bandwidth and faster transfer speeds, enhancing reliable circuit transmission for superior performance.
Multiple exclusive CPU and memory overclocking features in the brand-new Click BIOS X allow users to easily fine-tune performance, pushing system to its limits with precision and ease.
The fully aluminum I/O cover and extended heatsink design maximize the surface area for heat dissipation.
The wavy fin design increases heat dissipation by up to 50%, ensuring better cooling efficiency for high-performance components.
The dual cross heat-pipe connects two MOS heatsinks, significantly increasing the surface area for heat dissipation and enhancing overall cooling efficiency.
The 9W/mK thermal pads and extra choke pads provide better heat transfer to the heatsinks.
The double-sided M.2 thermal solution keeps M.2 SSDs cooler and faster, ensuring optimal performance for high-speed SSDs during intensive tasks.
The metal backplate strengthens the motherboard, while dedicated thermal pads on the backside assist in effective heat dissipation.
The combo fan header is a versatile component, functioning as both a pump or a fan header. It automatically detects whether it’s connected to a pump or PWM/DC fan, with its distinctive gray color ensuring easy identification for seamless installation.
Frozr control includes cooling management and optimization in MSI Center and BIOS, designed to ensure higher and stable performance for high-end gaming and computing setups even during the most demanding tasks.
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